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NEW SCHAFFNER RF EMISSIONS TESTING GUIDE PROVIDES COMPREHENSIVE, HANDY REFERENCE FOR ENGINEERS
Edison, NJ, January 2003 – A new, comprehensive engineering guide on RF emission testing is now available from Schaffner EMC. The handy reference guide describes the key aspects of three basic methods used to test EMC emissions in electronics and electrical products, including conducted testing using an AMN/LISN (Artificial Mains Network/Line Impedance Stabilizing Network); absorbing clamp testing for disturbance power on connected cables; and radiated emissions testing performed on an open area test site (OATS).
The 50-page guide highlights key aspects of each test method, such as test layouts and set-up configurations complete with descriptive diagrams. In addition, the guide provides information on the necessary equipment needed for each testing method as well as tips and precautions for conducting tests.
The guide's reference section defines industry terminology such as electromagnetic fields, decibels (dB), voltage standing wave ratio (VSWR), voltage reflection coefficient (VRC), and return loss (R). Conversion and ratio charts, as well as a listing of typical generic and product standards for RF emissions testing, including CISPR, IEC, and non-IEC or CISPR based standards, is also provided.
For copies of the RF Emission Handy Guide, or to request more information, please contact John Parnell, Schaffner EMC, Inc., 52 Mayfield Avenue, Edison, NJ 08837.
Tel: (732) 225-9533 ext. 225; Fax: (732) 225-4789; E-mail: jparnell@schaffner.com.
Web: www.schaffner.com.
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READER SERVICE INQUIRIES: Please forward all reader service inquiries to
John Parnell, Schaffner EMC, Inc., 52 Mayfield Avenue, Edison, NJ 08837.
Fax: (732) 225-4789; E-mail: jparnell@schaffner.com.
EDITOR'S NOTE: Schaffner EMC, Inc., provides the world's largest range of EMI components, EMC instrumentation and test systems for radiated and conducted interference, and advanced power supply test systems.
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